cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 1/6 BAT54SH cystek product specification small signal schottky diode BAT54SH description planar silicon schottky barrier diode encapsulated in a sod-123 ve ry small plastic smd package. features ?guard ring protected ? low forward voltage drop ? very small plastic smd package ?pb-free lead plating and halogen-free package mechanical data ? case: molded plastic, jedec sod-123. ? terminals: pure tin plated, solderable per mil-std-202 method 208 ? polarity: indicated by cathode band. ? weight: 0.01 gram approximately symbol outline BAT54SH sod-123 ordering information device package shipping marking BAT54SH sod-123 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel jv
cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 2/6 BAT54SH cystek product specification absolute maximum ratings symbol parameter conditions min max unit v r continuous reverse voltage - 30 v i f continuous forward current - 200 ma i frm repetitive peak forward current tp 1s, ? 0.5 - 300 ma i fsm non-repetitive peak forward current tp<10ms - 600 ma ptot total power dissipation tamb 25 - 400 mw tstg storage temperature -65 +150 tj operating junction temperature range -65 +125 tamb operating ambient temperature range -65 +125 characteristics (ta=25 c, unless otherwise specified) parameter symbol condition min. max. unit reverse breakdown voltage v br i r =100 a 30 - v v f (1) i f =0.1ma - 240 mv v f (2) i f =1ma - 320 mv v f (3) i f =10ma - 400 mv v f (4) i f =30ma - 500 mv forward voltage ( note ) v f (5) i f =100ma - 800 mv reverse leakage current ( note ) i r v r =25v - 2 a diode capacitance c d v r =1v, f=1mhz - 10 pf reverse recovery time trr when switched from i f = 10ma to i r =10ma; r l =100 ; measured at i r =1ma - 5 ns notes : pulse test, tp=300 s, duty cycle<2%. thermal characteristics symbol parameter conditions value unit r th j-a thermal resistance from junc tion to ambient note 1 250 k/w note 1 : device mounted on a fr-4 pcb
cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 3/6 BAT54SH cystek product specification typical characteristics forward current & forward voltage 0 50 100 150 200 250 0 200 400 600 800 1000 forward voltage-v f (mv) forward current-i f (ma) diode capacitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse biased voltage-v r (v) diode capacitance-cd (pf)
cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 4/6 BAT54SH cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 5/6 BAT54SH cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c302sh issued date : 2012.08.16 revised date : page no. : 6/6 BAT54SH cystek product specification sod-123 dimension marking: jv 2-lead sod-123 plastic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.102 0.110 2.600 2.800 d 0.018 0.026 0.450 0.650 b 0.059 0.067 1.500 1.700 e 0.140 0.152 3.550 3.850 c 0.041 0.049 1.050 1.250 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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